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Thermosetting Moulding Materials for Electronics Market: Epoxy Emerges as Most Sought after Application, CAGR over 5% throughout 2026 anticipated

Press release Description

Albany, New York, January 14, 2019: The semiconductor industry has profoundly embraced thermosetting resin moulding materials for electronics. In semiconductor industry, thermosetting resin moulding materials for electronics are the initial material for the manufacturing of fillers as a packaging materials for the encapsulation of microelectronics devices. In addition, demand for consumer electronics fueled by soaring purchasing power and demographic is expected to spur the thermosetting moulding materials for electronics market.

With respect to application, epoxy is being embraced for the manufacturing of lightweight components for military and commercial aircrafts which has resulted in enhanced vehicle mechanical strength and cost reduction along with lower emissions and lower consumption of fuel. These aforementioned excerpts are encapsulation of the report titled, “Global Market Study on Thermosetting Moulding Materials for Electronics: Growing Need for Semiconductor Filler Materials Primarily Driving Demand,” which has been lately incorporated in the extensive repository of Market Research Reports Search Engine (MRRSE).

Assessing a host of factors, thermosetting resin moulding materials for electronics market, in terms of market share, is expected to grow at a CAGR of over 5% during the assessment period 2018-2026. Thermosetting resin moulding materials for electronics is witnessing significant demand from automotive industry which could be attributed to light weight composite materials, protective coatings and lightweight. Moreover, the thermosetting resin moulding materials for electronics resin offers remarkable corrosion and rust protection.

In the past few years, Hexicon Inc. came up with different resin and water-borne formulations which could reduce curing time and volatile organic compounds (VOCs) emissions.

Thermosetting Moulding Materials for Electronics Market: Report Content

The report offers a thorough assessment through quantitative and qualitative analysis on the thermosetting moulding materials for electronics materials market. The report delves into the dynamics of the market along with insights through opportunity analysis. The report also segregates the market for an in-depth assessment on the thermosetting resin moulding materials for electronics. The market is segmented on the basis of material, application and region.

The report starts with executive summary followed by market introduction and market viewpoint. The report delves into value chain analysis and compares the production and consumption outlook.

The final section of the report delineates the competitive landscape of the market with a dashboard view. The section also sheds light on mergers, acquisitions and expansion. The section covers company overview, product portfolio, production footprint, strategy, sales footprint, channel footprint and profitability through market segments. Prominent companies covered in the report are The Quartz Corporation, Unimin-Sibelco, HPQ Silicon and Jiangsu Pacific Quartz Co., among others.

Thermosetting Moulding Materials for Electronics Market: Research Methodology

The research methodology in this report includes secondary sources, primary sources and analysis from panel of expert for the assessment period 2018-2026. Secondary sources applied in the report include, but are not limited to annual reports, government document, SEC filings, investors’ presentation, World Bank database, market reports, relevant patent, statistical database and regulatory database. Primary sources include telephonic interviews, e-mail interactions and honest reviews of the market across regions.  Expert panel relentlessly analyzes the report with the view to offer readers with authentic and unbiased report. The analysis of the performance of market across regions has been done taking   Y-o-Y growth and BPS into consideration. The report has been analyzed through absolute dollar opportunity analysis, which are often ignored while assessing the market.

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