The demand for a variety of optoelectronic components has skyrocketed in the past few years and the trend is expected to remain consistent over the years to come as well. A recent market research report published by Transparency Market Research states that the global optoelectronics components market will expand at a favorable 9.7% CAGR over the period from 2015 through 2023.
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Currently, the optoelectronic component industry is labor-intensive and depends majorly on manual piece-part assembly, making production slow and expensive. Typically, 60-80% of all the manufacturing expenses are incurred on packaging. Automating the packaging process can be a real game changer for the industry, leading to significant cost reductions of final products and improvement in volume and production yields. For established vendors operating in the global optoelectronics components market, packaging automation can be a key enabler for meeting the constantly rising demand for a variety of products in the global market. For start-ups and small- and medium-sized companies, packaging automation can help meet time-to-volume requirements necessary to establish them in the highly competitive market.
Challenges to Automation in Optoelectronic Component Packaging
The present state of the optoelectronics industry is in many ways similar to the early state of the electronic industry when automation was rare, with a vast set of discrete components, relatively low production and volume yields. With the convergence of automation in manufacturing activities, the industry saw a significant rise in production volumes and reduction in prices. Similarly, the optoelectronic components industry can significantly benefit from the automation of manufacturing process. However, currently there are significant challenges to automation in the industry.
Manufacturing of optoelectronic components includes a combination of unusual form factors, extreme accuracy, unusual materials and a myriad of difficulties arising from the need to guide light. These factors have collectively prevented most automation techniques currently available in the market from being used in the packaging of optical components.
Nevertheless, the market is witnessing the emergence of equipment suppliers who are able to pave their way through the limitations to the adoption of automation in optoelectronic component assembly. Further developments in the field will enable optoelectronic component designers in the efficient manufacture of optoelectronic components.
Browse the full Press Release of Global Optoelectronic Components Market at http://www.mrrse.com/global-optoelectronic-components-market
What can be Automated in Optoelectronic Components Market Today?
The first true automation in the field of optoelectronic component manufacturing has been seen for first-level interconnections such as wire bonding and eutectic and multichip epoxy die attachments. Looking at the amount of research and development happening in the field, it can be easily said that numerous other processes involving complex iterative alignment steps will also be performed by automated systems in the future years.
Some of the major players operating in the global optoelectronic component market are Vishay Intertechnology, Inc., OSRAM, Toshiba Corporation, Avago Technologies, Royal Philips Electronics, STMicroelectronics N.V., Diodes, Incorporated, Sony Corporation, Samsung Electronics Co., Ltd, Fairchild Semiconductor, Renesas Electronics Corporation, Sharp Corporation, Infineon Technologies AG, Maxwell Technologies, Inc., and EPISTAR Corporation.