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Electronic Circuit Board Level Underfill Material Market: Demand for Flip Chips Continues to Gain Ground

Press release Description

Albany, New York, May 10, 2018: A new market intelligence study titled “Electronic Circuit Board Level Underfill Material Market: Global Industry Analysis (2012 – 2016) and Opportunity Assessment (2017 – 2027)” has been added to the repository of Market Research Reports Search Engine (MRRSE). According to the report, the global electronic circuit board level underfill material market is likely to witness steady growth over the forecast period.

The report has segmented the market on the basis of board type, product type, material type, and region. By board type, flip chips is likely to remain the largest segment, and is likely to attain a valuation of over US$ 200 Mn by the end of 2027. By product type, the report projects the underfill segment to grow at a lucrative CAGR during the assessment period. By material type, epoxies are likely to rake in nearly US$ 196 Mn by the end of the forecast period. Asia Pacific excluding Japan (APEJ) is likely to be the leading market for electronic circuit board level underfills. The APEJ market was valued at nearly US$ 107 Mn in 2017, and it is highly likely that demand will increase at a steady CAGR over the period of forecast.

The report analyzes the global electronic circuit board level underfill material market on the basis of revenues. A historical analysis for the period 2012-2016 has been offered, and projections made for the year 2017-2027. The drivers, restraints, threats, and opportunities impacting production and revenue growth are discussed in detail in the report. The information presented in the report has been compiled from specialized sources in a bid to offer readers credible and transparent insights.

The report also offers a competitive landscape scenario that profiles strategies of some of the key players in this market. The competitive analysis is a valuable source of guidance and information that can help decision-makers in gaining competitive insights about the market. The key parameters discussed in the report include product portfolio, company overview, financial overview, and recent R&D initiatives. This section of the report will be particular beneficial for those companies who are planning to make a foray into the market, or thinking about expanding to new markets.

According to the report, some of the key players in the market include Henkal AG & Co. KGaA, Namics Corporation, Panasonic Corporation, Epoxy Technology, Inc., Protavic International, AI Technology, Inc., H.B. Fuller Company, ASE Group, The Dow Chemical Company, Indium Corporation, YINCAE Advanced Materials LLC Hitachi Chemical Co., Ltd., Zymet, Sanyu Rec Co., Ltd., Dymax Corporation, ELANTAS GmbH and LORD Corporation.

Browse Full Global Electronic Circuit Board Level Underfill Material Market Report with TOC :

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