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Global Advanced Semiconductor Packaging Market to Surpass US$ 67 Bn by 2026

Press release Description

Albany, New York, March 23, 2018: A new insightful study titled “Advanced Semiconductor Packaging Market – Global Industry Analysis, Size, Share, Growth, Trends and Forecast 2017 – 2026” has recently been submitted to the database of Market Research Reports Search Engine (MRRSE). According to the report, the global advanced semiconductor packaging market is likely to grow at nearly 11% CAGR during the forecast period. By 2026, the global revenues are likely to surpass US$ 67 Bn.

According to the report, the demand for highly effective semiconductor packaging is influencing manufacturers to invest in R&D. The size of wafers is one of the key factors for the efficiency of semiconductors and majority of manufacturers are focusing on this aspect. The conventional 2.5D packaging is being steadily replaced by fan out wafer level packaging as it can manage multiple dies. This mode of packaging is also growing traction among end-users as it reduces the need for water fluxing and bumping.

The report segments the global advanced semiconductor packaging market into end user, packaging type and region. The end user segment is further sub-segmented into consumer electronics, industrial, medical devices, aerospace & defense, automotive and telecommunications. The packaging type segment divides the global market into 2.5D/3D, flip chip, fan-in wafer-level packaging and fan-out wafer-level packaging. Geographically, the market is divided into key regions globally which are North America, Latin America, Europe, Asia Pacific Excluding Japan, Middle East & Africa and Japan.

According to the report, flip chip packaging type is likely to remain lucrative in terms of revenues during the assessment period. The flip chip packaging type segment is expected to surpass US$ 45 Bn by the end of the forecast period. Flip chip packaging offers high input output density and faster signal transfer, owing to which their adoption has been growing in small packages.

By application, central processing units are among the most lucrative channels, accounting for a significant revenue share. The report projects this segment to surpass over US$ 11.5 Bn in revenues by the end of the forecast period. In addition to this, dynamic random access memory is likely to grow at a staggering pace during the assessment period.

Consumer electronics are likely to remain the largest end-users of advanced semiconductor packaging solutions during the assessment period. By the end of the forecast period, consumer electronics are likely to rake in over US$ 15.6 Bn in revenues, with smartphones and wearable devices among the key product segments. By region, Asia Pacific excluding Japan (APEJ) is likely to remain one of the leading markets for advanced semiconductor packaging globally. High consumer electronic sales in China and India are likely to boost sales during the assessment period.

The report profiles some of the leading players operating in the market. Some of these players are Intel Corp, Amkor Technology, AMD, Hitachi Chemical, Infineon, STMicroelectronics, Sumitomo Chemical Co. Ltd., Kyocera¸Avery Dennison and ASE Group.

Browse Full Global Advanced Semiconductor Packaging Market Report with TOC :

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